Dust Resistance
You're on a construction site preparing a
bid for another job. Sawdust, sand and various other forms
of dirt are floating through the air. If your notebook's case,
card slots, ports and hinges are not sealed and designed to
resist dust, the bid you're working on may be your last. Dust
and dirt are ubiquitous in the field and have a way of invading
the exposed areas of notebooks, potentially slowing key functions
and damaging components.
The Dust Test
The Dust Resistance test was performed in accordance with MIL-STD-810F,
Method 510.4, Procedure I (Dust). An operating temperature of
140°F was used for this test. The upper non-operating temperature
of 140°F was incorporated into the test as this is the "default"
temperature given by the MIL-STD-810F guidelines. Silica flour
as defined by the test standard was used. Failure was considered
to have occurred if moving parts bind or are blocked, or if
contacts or relays malfunctioned. The units must have continued
to function also.
Sealed Keyboard & Touchpad
The keyboard and touchpad circuitry on some Toughbook models
are sealed with a membrane to protect against potential damage
from dirt and dust.
Sealed Case
Toughbook's unique sealed case construction allows it to function
without a fan or vents, which would expose the delicate internal
components to dust and dirt.
Click below on individual images for an enlarged picture
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