Dust Resistance

You're on a construction site preparing a bid for another job. Sawdust, sand and various other forms

of dirt are floating through the air. If your notebook's case, card slots, ports and hinges are not sealed and designed to resist dust, the bid you're working on may be your last. Dust and dirt are ubiquitous in the field and have a way of invading the exposed areas of notebooks, potentially slowing key functions and damaging components.

The Dust Test
The Dust Resistance test was performed in accordance with MIL-STD-810F, Method 510.4, Procedure I (Dust). An operating temperature of 140°F was used for this test. The upper non-operating temperature of 140°F was incorporated into the test as this is the "default" temperature given by the MIL-STD-810F guidelines. Silica flour as defined by the test standard was used. Failure was considered to have occurred if moving parts bind or are blocked, or if contacts or relays malfunctioned. The units must have continued to function also.

Sealed Keyboard & Touchpad
The keyboard and touchpad circuitry on some Toughbook models are sealed with a membrane to protect against potential damage from dirt and dust.

Sealed Case
Toughbook's unique sealed case construction allows it to function without a fan or vents, which would expose the delicate internal components to dust and dirt.

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